Methods and apparatus for producing integrated circuit devices

Details Methods and apparatus for producing integrated circuit devices Methods and apparatus for producing integrated circuit devices

H - Electricity

01

L

H01L 25/065 (2006.01) H01L 21/78 (2006.01) H01L 21/98 (2006.01) H01L 23/48 (2006.01) H01L 23/50 (2006.01) H01L 23/522 (2006.01)

Patent

CA 2144323

A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads (19) and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed.

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