Methods and apparatus for recovery of silicon and silicon...

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H01L 21/00 (2006.01) H01L 21/02 (2006.01) H01L 21/301 (2006.01) H01L 31/042 (2006.01)

Patent

CA 2721177

Methods, systems, and apparatus are disclosed herein for recovery of high- purity silicon, silicon carbide and PEG from a slurry produced during a wafer cutting process. A silicon-containing material can be processed for production of a silicon-rich composition. Silicon carbide and PEG recovered from the silicon- containing material can be used to form a wafer-saw cutting fluid. The silicon-rich composition can be reacted with iodine containing compounds that can be purified and/or used to form deposited silicon of high purity. The produced silicon can be used in the photovoltaic industry or semiconductor industry.

L'invention concerne des procédés, des systèmes et un appareil pour la récupération de silicium, carbure de silicium, et PEG haute pureté depuis une suspension produite pendant un processus de découpe de plaquettes. Un matériau contenant du silicium peut être traité pour la production d'une composition riche en silicium. Du carbure de silicium et du PEG retirés du matériau contenant du silicium peuvent être utilisés pour former un fluide de découpe de plaquettes à la scie. La composition riche en silicium peut être mise à réagir avec des composés contenant de l'iode qui peuvent être purifiés et/ou utilisés pour former du silicium déposé haute pureté. Le silicium produit peut être utilisé dans l'industrie photovoltaïque, ou l'industrie des semi-conducteurs.

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