Methods and systems of heat transfer for electronic enclosures

Details Methods and systems of heat transfer for electronic enclosures Methods and systems of heat transfer for electronic enclosures

H - Electricity

05

K

H05K 7/20 (2006.01) H05K 5/02 (2006.01)

Patent

CA 2444764

An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage and the heat sink provide an isolated heat transfer path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.

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