Methods for applying thermal barrier coating systems

Details Methods for applying thermal barrier coating systems Methods for applying thermal barrier coating systems

C - Chemistry, Metallurgy

22

C

C22C 19/05 (2006.01) C23C 28/00 (2006.01)

Patent

CA 2708888

Methods for coating a substrate includes depositing on the substrate, a inner bond coat layer of a bond coat composition comprising, in weight percent, 14-20 % Cr, 5-8 % Al, 8-12 % Co, 3-7 % Ta, 0.1- 0.6 % Hf, 0.1-0.5 % Y, up to about 1% Si, 0.005-0.020 % Zr, 0.04-0.08 % C, 0.01-0.02% B, with a remainder including nickel (Ni) and incidental impurities, wherein the bond coat composition is substantially free of rhenium; forming an aluminum- containing layer overlying the inner bond coat layer; and, optionally, depositing a thermal barrier coating composition overlying the aluminum-containing layer.

La présente invention concerne des procédés de revêtement d'un substrat qui consistent à déposer sur le substrat, une couche de liaison interne formée d'une composition de couche de liaison comprenant, en pourcentage en poids, 14-20 % de Cr, 5-8 % de Al, 8-12 % de Co, 3-7 % de Ta, 0,1-0,6 % de Hf, 0,1-0,5 % de Y, jusqu'à environ 1% de Si, 0,005-0,020 % de Zr, 0,04-0,08 % de C, 0,01-0,02% de B, le reste étant formé par le nickel (Ni) et les impuretés inévitables, ladite composition de couche de liaison étant sensiblement dépourvue de rhénium; à former une couche contenant de l'aluminium au-dessus de la couche de liaison interne; et, facultativement, à déposer une composition de revêtement barrière thermique au-dessus de la couche contenant de l'aluminium.

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