Methods for producing packaged integrated circuit devices &...

Details Methods for producing packaged integrated circuit devices &... Methods for producing packaged integrated circuit devices &...

H - Electricity

01

L

H01L 21/44 (2006.01) B81B 7/00 (2006.01) H01L 21/48 (2006.01) H01L 21/50 (2006.01) H01L 23/06 (2006.01) H01L 23/10 (2006.01) H01L 23/12 (2006.01) H01L 23/48 (2006.01) H01L 23/52 (2006.01) H01L 29/40 (2006.01)

Patent

CA 2394458

This invention discloses a crystalline substrate based device including a crystalline substrate (102) having formed thereon a microstructure (100); and at least one packaging layer (106) which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate (102) and the at least one packaging layer (106). A method of producing a crystalline substrate based device is also disclosed.

L'invention concerne un dispositif à base de substrat cristallin comportant un substrat cristallin (102) sur lequel est formé une microstructure (100); et au moins une couche d'encapsulation (106) scellée sur la microstructure au moyen d'un adhésif et y définissant au moins un espace entre le substrat cristallin (102) et ladite couche (106). L'invention concerne enfin un procédé de production d'un dispositif à base de substrat cristallin.

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