Methods for removing a stabilizer from a metal nanoparticle...

Details Methods for removing a stabilizer from a metal nanoparticle... Methods for removing a stabilizer from a metal nanoparticle...

H - Electricity

05

K

H05K 3/10 (2006.01) B82Y 30/00 (2011.01) C23C 30/00 (2006.01) H01L 21/288 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2648536

A method of forming conductive features on a substrate, the method comprising: providing two or more solutions, wherein a metal nanoparticle solution contains metal nanoparticles with a stabilizer and a destabilizer solution contains a destabilizer that destabilizes the stabilizer, liquid depositing the metal nanoparticle solution and the destabilizer solution onto the substrate, wherein during deposition or following the deposition of the metal nanoparticle solution onto the substrate, the metal nanoparticle and the destabilizer are combined with each other, destabilizing the stabilizer from the surface of the metal nanoparticles with the destabilizer and removing the stabilizer and destabilizer from the substrate by heating the substrate to a temperature below about 180 °C or by washing with the solvent.

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