Methods of forming electronic packages

Details Methods of forming electronic packages Methods of forming electronic packages

H - Electricity

01

L

H01L 21/48 (2006.01) H01L 23/14 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2076637

2076637 9113462 PCTABS00007 The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material (247) or a preform with molten matrix metal (250) and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its perfomance and/or bonding capabilities.

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