Methods of maintaining and using a high concentration of...

Details Methods of maintaining and using a high concentration of... Methods of maintaining and using a high concentration of...

C - Chemistry, Metallurgy

22

F

C22F 1/08 (2006.01) A01N 59/20 (2006.01) A01P 1/00 (2006.01) A61K 33/34 (2006.01) A61P 31/02 (2006.01) G06Q 90/00 (2006.01) G06Q 30/00 (2006.01)

Patent

CA 2652809

A method for maintaining and using a high concentration of dissolved copper on a surface of a useful article by providing a copper surface without coatings thereon which increase the wetting angle and which isolate the copper surface and which has a surface roughness between 2 and 50 micro inches Ra, so as to kill microbes thereon.

L'invention concerne un procédé permettant de maintenir et d'utiliser une concentration élevée de cuivre dissous sur une surface d'un article utile en préparant une surface de cuivre sans revêtements augmentant l'angle de mouillage et isolant la surface de cuivre et qui présente une rugosité de surface Ra comprise entre 2 et 5 micropouces, de manière à tuer les microbes présents sur celle-ci.

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