Methods of making and attaching tsp material for forming...

B - Operations – Transporting – 22 – F

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B22F 7/06 (2006.01) B22F 3/00 (2006.01) B23B 27/14 (2006.01) B23B 27/20 (2006.01) C04B 37/00 (2006.01) E21B 10/46 (2006.01)

Patent

CA 2760944

A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.

L'invention concerne un procédé de formation d'un ou de plusieurs comprimés de TSP. Le procédé consiste à placer une ou plusieurs couches de TSP dans une enceinte et à entourer chaque couche de TSP d'au moins un des matériaux suivants: une poudre de carbure de tungstène pré-fritté, une poudre de carbure de tungstène pré-cémenté, une poudre de carbure de tungstène ou de substrats de carbure de tungstène partiellement fritté. Le procédé consiste également à exposer l'enceinte à un procédé haute pression haute température, la poudre de carbure de tungstène pré-fritté, la poudre de carbure de tungstène pré-cémenté, la poudre de carbure de tungstène ou les substrats de carbure de tungstène partiellement fritté se liant aux couches de TSP, formant un empilement de couches de TSP comprenant les couches de TSP l'une sur l'autre avec le carbure de tungstène lié à chacune des couches de TSP et encapsulant chacune des couches de TSP.

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