Methods of manufacturing a printed circuit board shielded...

H - Electricity – 05 – K

Patent

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H05K 9/00 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2424885

Methods for the production of a board (11) with printed circuit (12) shielded against interfering radiation and having electronic components (14) comprise the steps of positioning of the electronic components (14) on contact points (15) designed for them, and the application of a shield (20), comprising a preformed metallized plastic film (30) over the top of the electronic components (14) and in electrical contact with the earth (13) on the board (11) with printed circuit (12), and also fixing the electronic components (14) on the board (11) with printed circuit (12) by means of an electrically conducting fixing agent (16); and fixing of the shield (20) on the board (11) with printed circuit (12).

L'invention concerne des procédés de production d'une carte (11) à circuit imprimé (12) blindée contre le rayonnement perturbateur et possédant des composants électroniques (14). Ce procédé comprend les étapes consistant à placer les composants électroniques (14) sur des points de contacts (15) conçus pour eux, à appliquer un blindage (20) comprenant un film plastique métallisé préformé (30) sur les composants électroniques (14) et en contact électrique avec la terre (13) sur la carte (11) à circuit imprimé (12), également à fixer les composants électroniques (14) sur la carte (11) à circuit imprimé (12) à l'aide d'un agent de fixation (16) conducteur au niveau électrique, et à fixer le blindage (20) sur la carte (11) à circuit imprimé (12).

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