Methods of manufacturing infrared detector elements

Details Methods of manufacturing infrared detector elements Methods of manufacturing infrared detector elements

H - Electricity

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L

356/116

H01L 31/18 (2006.01) H01L 25/04 (2006.01) H01L 31/09 (2006.01)

Patent

CA 1059646

ABSTRACT OF THE DISCLOSURE: A method of forming in a wafer of infra-red sensitive material a large plurality of infra-red detector elements each comprising a body having a rec- tangular surface configuration with a pair of low resistance contacts extending on oppositely located curved edges of the body at opposite sides of a sensi- tive area of the body. A wafer of the infra-red sensitive material is adhered to a supporting body and by a combination of masking etching and polishing techniques a plurality of elemental body portions of reduced thickness are defined in the wafer having oppositely located curved edges. Thereafter electri- cally conductive material is deposited to form the contacts on the surface of each elemental body portion and finally the elemental body portions and applied contacts are removed from the supporting body.

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