C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/10
C25D 21/00 (2006.01) C25D 5/00 (2006.01) C25D 5/02 (2006.01) C25D 7/06 (2006.01) H05K 3/24 (2006.01)
Patent
CA 1056761
METHODS OF PROVIDING CONTACT BETWEEN TWO MEMBERS NORMALLY SEPARABLE BY AN INTERVENING MEMBER Abstract of the Disclosure A continuous length, flexible, polymeric substrate has thin layers of copper clad to opposite sides thereof. Patterns of dry photopolymer material are applied to and mask selected portions of the copper to leave exposed other selected portions of the copper. The copper clad substrate is guided by a series of cathodic electrode rollers exterior of a copper plating bath into successive passes through the bath. Portions of the exposed copper contact the electrode rollers and couple the cathodic potential thereof to the bath to effect the plating of copper from the bath onto the exposed selected portions of the copper. Prior to initial engagement with the cathodic rollers, a series of protrusions are formed in portions of the exposed copper at a height relative to the thickness of the photoresist material sufficient to insure that the copper, by virtue of the protrusions, contacts the electrode rollers to facilitate the plating operation notwithstanding the intervening photoresist material.
237737
Hamby John T. (jr.)
Townsend Wesley P.
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