C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1402, 154/70
C08L 97/00 (2006.01) C08L 61/06 (2006.01) C08L 97/02 (2006.01)
Patent
CA 1136793
ABSTRACT OF THE DISCLOSURE A method of manufacturing composite wood products such as waferboard, particleboard and lumber products containing wood strands is disclosed incor- porating adhesives derived from wood chemicals rather than from petrochemical sources. In the method wherein wood pieces are coated with an adhesive mixture followed by a simultaneous pressure and heating step, the improve- ment comprises the steps of applying a water soluble phenol formaldehyde resole resin (PF) in a liquid form, powder form or a combination of liquid and powder form to the wood pieces, the PF in powder form having a pH of at least about 9 when one part by weight is mixed in ten parts water. Applying to the wood pieces, either before, after or at the same time as the application of the PF, methylolated kraft-lignin (MKL) organic solids in a liquid form, powder form or a combination of liquid and powder form. The MKL organic solids are up to about 70% by weight of the total organic solids in the ad- hesive mixture, and the adhesive mixture in liquid form has a pH of at least about 10. Liquid and powder adhesives formed from PF and MKL are also disclosed.
340813
Fetherstonhaugh & Co.
Macmillan Bloedel Limited
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