Mica-filled daillyl molding compounds

Details Mica-filled daillyl molding compounds Mica-filled daillyl molding compounds

C - Chemistry, Metallurgy

08

K

400/5033, 400/91

C08K 3/34 (2006.01) C08F 118/18 (2006.01) C08L 31/08 (2006.01)

Patent

CA 1096086

ABSTRACT OF THE DISCLOSURE Thermosetting diallylic molding compositions, free of asbestos, comprising a mixture of a diallyl phthalate prepolymer, a dry, air ground mica filler, and a polymerization initiator present in sufficient amount to convert the molding composition to the thermoset state at elevated temperatures are provided. These compositions may also contain allylic monomers, polyesters copolymerizable with the diallyl phthalate prepolymer, secondary reinforcing fibers and fillers, colorants, mold release agents, inhibitors and other conventional additives used in thermosetting molding compositions. The novel diallylic molding compositions of the present invention retain electrical, thermal and chemical properties of commercial asbestos-filled diallyl phthalate molding compounds and; in addition, exhibit reduced water absorption, reduced shrinkage, improved mechanical properties and eliminate the hazardous nature of asbestos fibers previously employed as filler in such molding compounds.

286500

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