Micro-electronics devices and methods of manufacturing same

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H01L 23/14 (2006.01) C03C 14/00 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H01L 23/498 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1331914

IMPROVED MICRO-ELECTRONICS DEVICES AND METHODS OF MANUFACTURING SAME Abstract of the Disclosure A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.

530049

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