Micro passage chip and fluid transferring method

Details Micro passage chip and fluid transferring method Micro passage chip and fluid transferring method

G - Physics

01

N

G01N 35/08 (2006.01) B01J 19/00 (2006.01) B81B 3/00 (2006.01) G01N 37/00 (2006.01)

Patent

CA 2656686

Provided is a novel micro passage chip having a structure capable of transferring a fluid from above the substrate of the micro passage chip even if physical or mechanical drawing means is not used. The micro passage chip is characterized to include at least a first substrate and a second substrate, and an intermediate substrate interposed between the first substrate and the second substrate. At least one of the adhered faces of the first substrate and the intermediate substrate has a first unadhered thin film layer formed thereon. At an arbitrary position over the first unadhered thin film layer, there is arranged at least one fluid port, which contacts with the first unadhered thin film layer and which is opened to the outer surface of the first substrate. On the face on at least one of the adhered faces of the first substrate and the intermediate substrate, there is so formed at least a portion of the second unadhered thin film layer, which has a length equal to or different from that of the first unadhered thin film layer, as vertically overlaps the first unadhered thin film layer through the intermediate substrate. On at least one portion over the second unadhered thin film layer, there is arranged a pressure port, which contacts with the second unadhered thin layer and which is opened in the outer surface of the first or second substrate.

La présente invention concerne une nouvelle puce à micro passage qui possède une structure capable de transférer un fluide depuis la partie supérieure du substrat de la puce à micro passage et ce, même sans utiliser des moyens d'acheminement physiques ou mécaniques. La puce à micro passage se caractérise en ce qu'elle comprend au moins un premier et un second substrat et un substrat intermédiaire disposé entre les deux substrats précédents. L'une au moins des faces collées du premier substrat et du substrat intermédiaire présente une première couche de film mince non collée formée sur celle-ci. À une position aléatoire au-dessus de la première couche de film mince non collée, se trouve au moins un orifice de fluide qui vient au contact de la première couche de film mince non collée et qui s'ouvre sur la surface externe du premier substrat. Sur la face de l'une au moins des faces collées du premier substrat et du substrat intermédiaire, une partie au moins de la seconde couche de film mince non collée, dont la longueur est égale à ou différente de celle de la première couche de film mince non collée, est formée de manière à chevaucher verticalement la première couche de film mince non collée à travers le substrat intermédiaire. Sur une partie au moins se trouvant au-dessus de la seconde couche de film mince non collée, se trouve un orifice de pression qui vient au contact de la seconde couche de film mince non collée et qui s'ouvre sur la surface externe du premier ou du second substrat.

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