Micro-relief structures

Details Micro-relief structures Micro-relief structures

B - Operations, Transporting

32

B

B32B 3/30 (2006.01) B42D 15/10 (2006.01)

Patent

CA 2751013

The present invention provides a method of forming a relief pattern as part of a layered structure and comprising, forming a re- lief pattern on the surface of a layer of the said structure and subsequently forming a protective fixing layer on at least part of the said relief pat- tern and serving to protect the underlying relief pattern during any subsequent processing of the said structure, and thereby also provides for a layered structure, generally comprising a sub-strate having a relief pattern formed on a sur-face of the substrate and wherein at least a por-tion of the said relief has been provided with a protective fixing layer serving to retain the characteristics of the relief pattern during any subsequent processing of the structure such as, for example, when forming a laminate structure with the relief pattern provided therein.

La présente invention se rapporte à un procédé de formation d'un motif en relief en tant que partie d'une structure en couches et comprenant la formation d'un motif en relief sur la surface d'une couche de ladite structure puis la formation d'une couche de fixation protectrice sur au moins une partie dudit motif en relief servant à protéger le motif en relief sous-jacent au cours de tout traitement ultérieur de ladite structure. L'invention concerne ainsi également une structure en couches, comprenant généralement un substrat comportant un motif en relief formé sur une surface du substrat, au moins une partie dudit relief étant pourvue d'une couche de fixation protectrice servant à conserver les caractéristiques du motif en relief au cours de tout traitement ultérieur de la structure comme, par exemple, lors de la formation d'une structure stratifiée dans laquelle se trouve le motif en relief.

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