Micro-structure cooling device and use thereof

Details Micro-structure cooling device and use thereof Micro-structure cooling device and use thereof

H - Electricity

01

L

H01L 23/473 (2006.01)

Patent

CA 2493408

The invention relates to a micro-structure cooling device (3) for an object (4) to be cooled, whereby the cooling device (3) includes a stack of at least two metal foils (1) and one base plate (5) that can be brought via a thermal contact surface (6) into thermal contact with the object (4), the metal foils (1) and the base plate (5) are joined to one another in a material fit, present in the metal foils (1) are channels (2) for cooling medium, and the channels (2) have a width in the range of from 100 to 2,000 ~m, a depth in the range of from 25 to 1,000 ~m and a mean interval in the range of from 50 to 1,000 ~m, the residual foil thickness resulting from the channels (2) in the metal foils (1) are in the range of from 50 to 300 ~m, and the base plate (5) has a thickness in the range of from 200 to 2,000 ~m.

Cette invention concerne un dispositif de refroidissement à micro-structures (3) destiné à un objet (4) à refroidir. Le dispositif de refroidissement (3) comprend un empilement d'au moins deux papiers métalliques (1) et d'une plaque de base (5) pouvant être amenés, par le biais d'une surface de contact thermique (6) en contact thermique avec l'objet (4). Les papiers métalliques (1) et la plaque de base (5) sont réunis par ajustement des matériaux. Les papiers métalliques (1) comportent de canaux (2) d'écoulement d'un fluide de refroidissement qui présentent une largeur de l'ordre de 100 à 2.000 ?m, une profondeur de 25 à 1.000 ?m et un intervalle moyen de 50 à 1.000 ?m. L'épaisseur résiduelle du papier résultant des canaux (2) ménagés dans les papiers métalliques (1) est de l'ordre de 50 à 300 ?m, et l'épaisseur de la plaque de base (5) est de l'ordre de 200 à 2.000 ?m.

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