G - Physics – 01 – N
Patent
G - Physics
01
N
G01N 35/08 (2006.01) B01J 19/00 (2006.01) B81B 1/00 (2006.01) B81C 1/00 (2006.01) G01N 37/00 (2006.01)
Patent
CA 2641443
A microchannel chip having a microchannel is manufactured without using an original form such as a mold. The microchannel chip is composed of at least an upper substrate and a lower substrate, and the upper substrate is bonded with the lower substrate. In the microchannel chip, one or more nonadhering thin film layers are formed on the adhering surface side of at least one substrate, and the both ends of the nonadhering thin film layer are connected to a port opened toward atmosphere. When a positive pressure is applied from one port, a nonadhering thin film portion bulges and a space which can function as a microchannel is generated. As a result, liquid and/or air can be transferred from one port to the other.
La puce à microcanal selon l'invention comportant un microcanal est fabriquée sans utiliser de forme originale comme un moule. La puce à microcanal est composée d'au moins un substrat supérieur et d'un substrat inférieur, et le substrat supérieur est connecté au substrat inférieur. Dans la puce à microcanal, une ou plusieurs couches de pellicule mince non adhésive sont disposées sur la surface adhésive d'au moins un substrat et les deux extrémités de la couche de pellicule mince non adhésive sont connectées à un port ouvert vers l'atmosphère. Lorsqu'une pression positive est appliquée à un port, une partie de la pellicule mince non adhésive enfle et un espace qui peut servir de microcanal est créé. Par conséquent, le liquide et/ou l'air peuvent être transférés d'un port à l'autre.
Hagiwara Hisashi
Mishina Yoshinori
Shiraishi Toshiharu
Aida Engineering Ltd.
Kirby Eades Gale Baker
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