Microelectronic circuit coating system

Details Microelectronic circuit coating system Microelectronic circuit coating system

H - Electricity

05

K

356/166

H05K 3/00 (2006.01) C23C 16/04 (2006.01) H01L 21/00 (2006.01) H01L 21/316 (2006.01) H01L 21/60 (2006.01) H01L 23/31 (2006.01)

Patent

CA 1059648

ABSTRACT OF THE DISCLOSURE A coating system selectively applies silicon dioxide to a microelectronic die which is mounted, for example, on a lead frame. During deposition, the system selectively masks the die and the lead frame so that silicon dioxide is applied over the die wire-to-lead frame junctions and is prevented from forming on the rest of the lead frame, thus keeping the lead frame clear for subsequent electrical connections.

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