Microelectronic component carrier and method of its manufacture

Details Microelectronic component carrier and method of its manufacture Microelectronic component carrier and method of its manufacture

H - Electricity

01

L

H01L 23/498 (2006.01) H01F 17/06 (2006.01) H01F 27/02 (2006.01) H01F 41/10 (2006.01) H01L 21/28 (2006.01) H01L 21/44 (2006.01) H01L 21/58 (2006.01) H01L 21/60 (2006.01) H01L 21/98 (2006.01) H01L 23/32 (2006.01) H01L 23/48 (2006.01) H01L 23/495 (2006.01) H01R 43/01 (2006.01) H05K 3/30 (2006.01) H01F 5/04 (2006.01) H01F 27/29 (2006.01)

Patent

CA 2304537

A microelectronic component carrier package (100) and method of its manufacture. A nonconducting component carrier having vertical risers (110) and guide channels (108) permits the rapid and accurate routing of microelectronic component leads with respect to a leadframe (104). Specially shaped perforations (116) in the leadframe (104) adjacent to and aligned with the guide channels (108) receive the leads, strip away the necessary amount of insulation, and sever the leads (124) to the proper length in one manufacturing process step. The leads are joined to the leadframe (104) by an interference fit, convention bonding technique (such as solder or thermal compression bonding), or other technique. The perforations (116) further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe (104) and leads to reside outside of the package, thereby minimizing the overall volume of the package. The perforations (116) may also be used as masks for laser energy used to strip insulation from the leads in the vicinity of the perforations (116).

L'invention concerne un boîtier support de composant électronique (100) et un procédé de fabrication. Un support d'élément non conducteur doté de colonnes verticales (110) et de canaux de guidage (108) permet une progression rapide et précise des conducteurs du composant par rapport à un réseau de conducteurs (104). Des perforations de forme spéciale (116) dans ledit réseau (104), adjacentes aux canaux de guidage (108) et alignées sur eux, reçoivent les conducteurs, dénudent la quantité nécessaire d'isolation, et sectionnent lesdits conducteurs (124) à la longueur appropriée, en une seule étape de fabrication. Les jointures entre les conducteurs et le réseau de conducteurs (104) sont réalisées comme suit : ajustement serré, technique de liaison classique (par exemple, soudure ou soudure par thermocompression), ou autre tehcnique. En outre, les perforations (116) permettent une relaxation des contraintes exercées sur les conducteurs dans le boîtier assemblé, et permettent aussi de maintenir les jointures entre le réseau de conducteurs (104) et les conducteurs à l'extérieur du boîtier, ce qui réduit au minimum le volume global du boîtier. On peut également utiliser les perforations (116) comme masques à énergie laser dans le dénudage d'isolation sur les conducteurs, au voisinage desdites perforations (116).

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