Microelectronics package

Details Microelectronics package Microelectronics package

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 21/50 (2006.01) H01L 23/15 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2096008

2096008 9208606 PCTABS00013 A microelectronics substrate assembly comprising: an advanced ceramics substrate (21) having a top surface and a bottom surface; a first metallized distribution plane (22) on said top surface and a second metallized distribution plane (26) on said bottom surface; an electrical connection (23) between said first and second distribution planes; at least one first metallized pad (24) on said top surface electrically isolated from said first distribution plane (22) and at least one metallized pad (28) on said bottom surface, electrically isolated from said second distribution plane (26), wherein said distribution planes (22, 26) and said metallized pads (24, 28) are arranged substantially symmetrically with respect to a plane between and parallel to said top and said bottom surfaces.

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