C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
85/2, 400/3012,
C08L 63/00 (2006.01) C08J 3/24 (2006.01) C09J 163/00 (2006.01) F16B 39/22 (2006.01) F16B 39/34 (2006.01) F16B 33/06 (2006.01)
Patent
CA 1217294
ABSTRACT A microencapsulated epoxy adhesive system is disclosed comprising in admixture epoxy resin capsules and encapsulated "Ancamine TL"TM (Pacific Anchor Chemical Co.) as the curing agent. When applied, for example to a zinc plated bolt and the bolt is tightened, the capsules break and the resin cures and provides good breakaway torques. In a further embodiment of the invention, the epoxy adhesive system includes a filler.
400674
Davis Colin E.
Hart Ronald L.
Work Dale E.
Capsulated Systems Inc.
Gowling Lafleur Henderson Llp
LandOfFree
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