Microfiber dielectrics which facilitate laser via drilling

Details Microfiber dielectrics which facilitate laser via drilling Microfiber dielectrics which facilitate laser via drilling

H - Electricity

05

K

H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2378282

This invention concerns electronic substrates comprising a non-woven filler material cousisting primarily of micro-fiber glass, and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs (16, 18), metal clad laminates, and printed wiring boards with and without lased via holes (20). The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg (16, 18) and forming at least one via (20) in the prepreg (16, 18).

Cette invention concerne des substrats électroniques comprenant un matériau de charge non tissé se composant essentiellement de microfibre de verre, et un matériau de résine. L'invention concerne également des produits électroniques fabriqués à partir des substrats électroniques de l'invention, comprenant, sans être limités aux préimprégnés (16, 18), des stratifiés à plaquage métallique, et des plaquettes de circuit imprimé présentant ou non des traversées (20) effectuées par laser. L'invention concerne encore un procédé de fabrication de plaquettes de circuit construit, comprenant les étapes consistant à former un préimprégné (16, 18) et à former au moins une traversée (20) dans ce préimprégné (16, 18).

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