Microlaser cavity assembly and associated packaging method

Details Microlaser cavity assembly and associated packaging method Microlaser cavity assembly and associated packaging method

H - Electricity

01

S

H01S 3/05 (2006.01) H01S 3/02 (2006.01) H01S 3/04 (2006.01) H01S 3/042 (2006.01) G02F 1/37 (2006.01) H01S 3/06 (2006.01) H01S 3/113 (2006.01)

Patent

CA 2441855

A cavity assembly includes a mounting member, an active gain medium, at least one electro-optic component and at least one alignment assembly. The mounting member defines an aperture within which the active gain medium is disposed, and is comprised of a thermally conductive material. The alignment assemblies are disposed relative to the active gain medium, and are configured to receive the electro-optic components such that electro-optic components at least partially align with the active gain medium. The alignment assemblies are rotatably disposed relative to the active gain medium such that relative rotation of the alignment assemblies and the active gain medium alters the alignment of the respective electro-optic components with respect to the active gain medium. The cavity assembly may be mounted within a thermally conductive housing to transfer heat away from the active gain medium.

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