B - Operations – Transporting – 24 – B
Patent
B - Operations, Transporting
24
B
B24B 19/00 (2006.01) B41J 2/16 (2006.01)
Patent
CA 2503918
A method of forming fluid handling slots in a semiconductor substrate having a thickness defined by a first side and a second side is provided. The method comprises ultrasonic grinding, utilizing an abrasive material, into the semiconductor substrate from a first side to form a first trench, and removing semiconductor substrate material from the backside to form a second trench, wherein at least a portion of the first and second trenches intersect to form a feature through the semiconductor substrate.
Hewlett-Packard Development Company L.p.
Sim & Mcburney
LandOfFree
Micromachining methods and systems does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micromachining methods and systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromachining methods and systems will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1672939