C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 7/02 (2006.01) A63B 53/00 (2006.01) A63B 59/00 (2006.01) C09J 11/08 (2006.01)
Patent
CA 2185121
A pressure sensitive adhesive tape that employs a water-absorptive backing, a microparticle-containing pressure sensitive adhesive and a water-dispersible component is provided. A method of bonding close fitting parts is also disclosed. In the method, a microparticle- containing pressure-sensitive adhesive tape (with or without the water-dispersible component in the adhesive) is employed. Articles made using the tape and/or by the method are also disclosed.
Bande adhésive autocollante comportant un support absorbant l'eau, un adhésif autocollant contenant des microparticules, ainsi qu'un constituant dispersible dans l'eau. L'invention concerne également un procédé de liaison d'éléments affleurés, dans lequel on utilise une bande adhésive autocollante contenant des microparticules (l'adhésif comportant ou non le constituant dispersible dans l'eau). L'invention concerne encore des articles fabriqués à l'aide de la bande et/ou du procédé.
Brown Mary L.
Goetz Richard J.
Pohl Daniel P.
Minnesota Mining And Manufacturing Company
Smart & Biggar
LandOfFree
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