Microperforated polymeric film for sound absorption and...

G - Physics – 10 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G10K 11/16 (2006.01)

Patent

CA 2337614

Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.

La présente invention concerne des films polymériques microperforés et des absorbeurs de son utilisant de tels films. Ces films polymériques microperforés peuvent être relativement minces et souples et peuvent comprendre des trous dont le diamètre le plus petit est inférieur à l'épaisseur du film, et dont le diamètre le plus grand est supérieur au plus petit diamètre. Les films polymériques microperforés d'un absorbeur de son peuvent aussi présenter de grandes portions libres qui, dans certaines réalisations, peuvent vibrer en réponse à des ondes sonores incidentes.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Microperforated polymeric film for sound absorption and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microperforated polymeric film for sound absorption and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microperforated polymeric film for sound absorption and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1677033

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.