Microphone wind shield and method for production thereof

H - Electricity – 04 – R

Patent

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Details

H04R 1/08 (2006.01) B41M 3/12 (2006.01) G09F 3/10 (2006.01) G09F 23/00 (2006.01)

Patent

CA 2313971

A method is disclosed for disposing a letter sequence onto the outer surface of a microphone wind shield made from foamed material. The method comprises the steps of producing at least one letter sequence element on a carrier; positioning the carrier onto the outer surface of the wind shield body by interposing a heat-activating adhesive; application of thermal energy by means of radiation, in particular, laser beams, for activating the adhesive; and removing the carrier after cooling and solidification of the adhesive. The letter sequence element thereby remains on the outer surface of the wind shield body.

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