C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
117/47.2
C08L 61/06 (2006.01) C08J 3/12 (2006.01) C08J 3/14 (2006.01) C08K 3/16 (2006.01)
Patent
CA 1243909
ABSTRACT OF THE DISCLOSURE A resole resin in the form of microspherical particles whose surfaces are partly or entirely covered with a coating of a substantially water-insoluble inorganic salt and which are not larger than 500 µm in size, and a process for producing such resole resin. The resole resin comprises solid particles that are highly heat reactive and can be stored in a stable manner for a prolonged period. The resin particles can be used with good results in all fields of applica- tions (e.g., moldings, laminations and binders) where conventional phenolic resins are used.
486665
Asami Keiichi
Echigo Yoshiaki
Ishikura Tadashi
Shidei Ritsuko
Suematu Yoshiyuki
Riches Mckenzie & Herbert Llp
Unitika Ltd.
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