Microstrip circuit temperature compensation

H - Electricity – 01 – Q

Patent

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351/58, 343/67

H01Q 21/08 (2006.01) H01Q 13/08 (2006.01) H01Q 13/20 (2006.01) H01Q 21/06 (2006.01)

Patent

CA 1245760

ABSTRACT OF THE DISCLOSURE In order to achieve temperature compensation in a microstrip linear array, the array is periodically loaded by means of a plurality of open circuited stubs coupled to the main transmission line through tightly controlled gap dimensions to provide increasing shunt susceptance which compensates for the decease in shunt susceptance of the line as temperature increases.

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