Microwave circuit board

H - Electricity – 05 – K

Patent

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356/12

H05K 1/02 (2006.01) H01B 3/00 (2006.01) H01P 3/08 (2006.01) H01P 11/00 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1126411

MICROWAVE CIRCUIT BOARDS Abstract of the Disclosure Microwave circuit boards and methods of making microwave circuit boards, the circuit boards having re- latively high dielectric constants, excellent moisture resistance, and reduced tendency to incur changes in di- mensions after processing. The method comprises blend- ing in a polymer dispersion, a particulate filler mate- rial having a high dielectric constant and micro-fibrous material to form a slurry of polymer, filler, and fiber. A flocculant is added to the slurry to agglomerate the polymer particles, the filler particles, and the micro- fibers to produce a dough-like material. The dough-like material is eventually formed into a sheet, and is there- after dried. A conductive foil such as copper is then applied to both sides of the sheet to provide a microwave circuit board.

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