H - Electricity – 03 – L
Patent
H - Electricity
03
L
331/50, 333/92
H03L 1/00 (2006.01) H03B 5/18 (2006.01) H03B 5/30 (2006.01) H03B 9/14 (2006.01) H03B 1/00 (2006.01)
Patent
CA 1210461
ABSTRACT A substrate made of a material having a high dielectric constant is mounted on a bottom internal surface of a hermetically sealed metal package, while carrying thereon a microwave active element chip and a dielectric resonator. A threaded hole extends throughout the bottom wall of the package from the outside to the inside in alignment with the position of the dielectric resonator on the substate. A metal screw is engaged in the threaded hole from outside the package. The screw may be turned to vary the distance between it and the dielectric resonator to adjust the oscillation frequency.
449653
Mizumura Motoo
Wada Kenzo
Corporation Nec
Smart & Biggar
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