Microwave oven package

Details Microwave oven package Microwave oven package

H - Electricity

05

B

H05B 6/80 (2006.01) B32B 3/10 (2006.01) B32B 15/08 (2006.01) B32B 33/00 (2006.01) B65D 81/34 (2006.01) H05B 6/64 (2006.01)

Patent

CA 2041065

18 ABSTRACT OF THE DISCLOSURE A laminate structure useful for incorporating into a package structure for the microwave cooking of foodstuffs for consumption comprises an outer layer polymeric material, an outer layer of microwave transparent material, a grid layer having an electroconductive surface surrounding transmissive apertures located between the outer layers, and a thin layer of electroconductive material of sufficient thickness so that a portion of incident microwave energy is converted to thermal energy also located between the outer layers. The structure is useful in providing controlled surface heating and microwave transmittance to achieve a more uniformly heated product employing less structural material than the prior art.

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