Microwave packaging having patterned adhesive, and methods

H - Electricity – 05 – B

Patent

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H05B 6/80 (2006.01) B65D 65/14 (2006.01) B65D 81/34 (2006.01)

Patent

CA 2390098

A microwave popcorn package (1) has an inner ply (46) and an outer ply (47) of flexible material, such as paper, with a microwave interactive construction (45) therebetween. The plies (46, 47) are bonded together with a laminating adhesive that is applied in a regular pattern of polygonal adhesive areas. This pattern occupies at least 80 square inches (516 cm2) of the surface between the plies (46, 47), and provides no more than 50% adhesive coverage of that area where the pattern is located. The adhesive polygons can be squares or diamonds. A second adhesive pattern can be present in a second portion of the ply surface.

Cet emballage micro-ondes pour pop-corn (1) est constitué d'un pli intérieur (46) et d'un pli extérieur (47) d'un matériau souple tel que le papier, plis entre lesquels se trouve une structure sensible aux micro-ondes (45). Ces plis (46, 47) sont liés l'un à l'autre par un adhésif de complexage appliqué selon un motif régulier fait de surfaces adhésives polygonales. Le motif d'encollage occupe au moins 80 pouces carrés (516 cm?2¿) de la surface entre les plis (46, 47) tout en n'excédant pas 50% de couverture en colle de la zone où se situe le motif d'encollage. Les polygones de colle peuvent être des carrés ou des losanges. Un second motif d'encollage peut être présent dans une seconde partie de la surface du pli.

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