Microwave semiconductor device with improved thermal properties

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/119, 356/53,

H01L 29/06 (2006.01) H01L 23/36 (2006.01) H01L 25/07 (2006.01) H01L 29/864 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1095178

Abstract of the Disclosure A microwave semiconductor device with improved thermal properties is disclosed wherein multiple active semiconductor bodies are disposed between two electrically and thermally isolated heat sinks. Two separate thermal paths are provided for heat produced within the semiconductor material. The maximum operating power of devices such as double-drift IMPATT diodes is greatly extended.

309907

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Microwave semiconductor device with improved thermal properties does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microwave semiconductor device with improved thermal properties, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave semiconductor device with improved thermal properties will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-895415

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.