Microwaveable packaging compositions

C - Chemistry – Metallurgy – 09 – D

Patent

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C09D 5/32 (2006.01) B65D 81/34 (2006.01)

Patent

CA 2045708

WS 35756 ABSTRACT "MICROWAVEABLE PACKAGING COMPOSITIONS" Microwaveable packing compositions exhibiting improved temperature control are provided. These compositions comprise a dielectric substrate having at least a portion of at least one of its surfaces coated with a matrix composition containing susceptor particles as well as particles of a blocking agent selected from the group consisting of calcium salts, zinc salts, zinc oxide, lithopone, silica and titanium dioxide. Also disclosed is a microwaveable ink composition useful for the preparation of such packaging compositions as well as a process for manufacturing such packaging compositions.

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