Middle layer of die structure that comprises a cavity that...

Details Middle layer of die structure that comprises a cavity that... Middle layer of die structure that comprises a cavity that...

H - Electricity

01

L

H01L 21/50 (2006.01) B81C 99/00 (2010.01) B32B 15/01 (2006.01) G04F 5/14 (2006.01) H01L 21/56 (2006.01) H01L 23/28 (2006.01) H01S 5/02 (2006.01)

Patent

CA 2497944

An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

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