Miniature microdevice package and process for making thereof

Details Miniature microdevice package and process for making thereof Miniature microdevice package and process for making thereof

H - Electricity

01

L

H01L 23/10 (2006.01) B81B 7/00 (2006.01)

Patent

CA 2410430

The present invention is concerned with a miniature microdevice package (37) and a process of making thereof. The package (37) has a miniature frame substrate (38) made of a material selected form the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate (38) has a spacer (39) delimiting a hollow (40). The package (37) also includes a microdevice die (41) having a microdevice substrate (44), a microdevice (45) integrated on the microdevice substrate (44), bonding pads (49) integrated on the microdevice substrate (44), and electrical conductors integrated in the microdevice substrate (44) for electrically connecting the bonding pads (49) with the microdevice (45). The microdevice die (41) is mounted on the spacer (39) to form a chamber (48). The microdevice (45) is located within the chamber (48). The bonding pads (49) are located outside of the chamber (48).

L invention concerne un boîtier de microdispositif (37) miniature et son procédé de fabrication. Le boîtier (37) comprend un substrat de cadre (38) miniature composé d'une matière sélectionnée dans le groupe constitué par une céramique, un métal, et une combinaison de céramique et de métal. Le substrat de cadre (38) miniature comprend un élément d'espacement (39) qui délimite un creux (40). Le boîtier (37) comprend un dé (41) doté d'un substrat (44), un microdispositif (45) monté sur ledit substrat (44), des plots de connexion (49) également montés sur le substrat (44), et des conducteurs électriques intégrés dans le substrat (44) de façon à connecter électriquement les plots de connexion (49) et le microdispositif (45). Le dé (41) est monté sur l'élément d'espacement (39) afin de former une chambre (48). Le microdispositif (45) est placé dans ladite chambre (48), les plots de connexion (49) étant placés à l'extérieur de cette chambre (48).

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