Miniaturized bus bar and assembly technique

Details Miniaturized bus bar and assembly technique Miniaturized bus bar and assembly technique

H - Electricity

02

G

26/131, 337/30

H02G 5/00 (2006.01) H05K 1/02 (2006.01) H05K 1/16 (2006.01)

Patent

CA 1181498

-11- MINIATURIZED BUS BAR AND ASSEMBLY TECHNIQUE Abstract of the Disclosure: Structure for and a method of construction of miniaturized bus bars are presented wherein the bus bar incorporates discrete high capacitive elements between a pair of bus bar conductors, the high capacitive elements being defined by wafers of material having a high dielectric constant coated with layers of conductive polymer. The conductive polymer is used to bind the chips between the bus bar conductors.

398587

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