Minimization of interfacial resistance across thermoelectric...

Details Minimization of interfacial resistance across thermoelectric... Minimization of interfacial resistance across thermoelectric...

H - Electricity

01

L

H01L 21/4763 (2006.01)

Patent

CA 2622981

A coating architecture (106, 206, 306) minimizing interfacial resistance across an interface (100, 200, 300) of a metal (104, 204, 304) and a semiconductor including at least two layers (108, 110, 112, 208, 210, 212, 306) intermediate the metal (104, 204, 304) and the semiconductor.

La présente invention concerne une structure de revêtement (106, 206, 306) destinée à minimiser la résistance intefaciale dans l~interface (100, 200, 300) d~un métal (104, 204, 304) ainsi qu~un semiconducteur présentant au moins deux couches (108, 110, 112, 208, 210, 212, 306) entre le métal (104, 204, 304) et le semiconducteur.

Affiliated with

Also associated with

Rating

Minimization of interfacial resistance across thermoelectric... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Minimization of interfacial resistance across thermoelectric..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Minimization of interfacial resistance across thermoelectric... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1855783