Mirror assembly for lasers

H - Electricity – 01 – S

Patent

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Details

345/10, 88/113.1

H01S 3/08 (2006.01) G01C 19/64 (2006.01) G02B 1/10 (2006.01) G02B 5/08 (2006.01)

Patent

CA 1304614

64159-983 ABSTRACT Discloses a mirror chip and mirror assembly for ring laser angular rate sensors. A mirror assembly utilizes a silicon substrate upon which is deposited in mirror material. The silicon substrate is then affixed to a second substrate by a thermally sealable bonding agent.

554904

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