Mirror assembly for lasers

Details Mirror assembly for lasers Mirror assembly for lasers

H - Electricity

01

S

345/10, 88/113

H01S 3/083 (2006.01) G01C 19/66 (2006.01) G02B 1/10 (2006.01) G02B 5/08 (2006.01) H01S 3/08 (2006.01)

Patent

CA 1298507

64159-926 ABSTRACT A mirror chip and mirror assembly are disclosed for use with a laser, and specifically, a ring laser angular rate sensor. The mirror chip includes a mirror material deposited upon a silicon wafer. The mirror assembly includes the silicon wafer bonded to a secondary supporting substrate. The mirror chip and supporting substrate are highly polished so that they may be bonded together by an optical contact bond.

522829

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