Mixed-resistance structured packing

Details Mixed-resistance structured packing Mixed-resistance structured packing

B - Operations, Transporting

01

J

B01J 19/32 (2006.01) F25J 3/02 (2006.01) F25J 3/04 (2006.01) F28F 25/08 (2006.01)

Patent

CA 2292131

A layer of mixed-resistance structured packing includes: a first structured packing having a first packing resistance; and a second structured packing generally horizontally adjacent the first structured packing, the second structured packing having a second packing resistance different than the first packing resistance. The layer of mixed-resistance structured packing is used in exchange columns for exchanging heat and/or mass between a first phase and a second phase in processes such as cryogenic air separation. Use of the layer of mixed-resistance structured packing reduces HETP (height equivalent to a theoretical plate) in the exchange columns and processes. A method also is provided for assembling the layer of mixed-resistance structured packing in an exchange column.

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