Mixture for the removal of light-sensitive resin in the...

Details Mixture for the removal of light-sensitive resin in the... Mixture for the removal of light-sensitive resin in the...

G - Physics

03

F

G03F 7/32 (2006.01) G03F 7/42 (2006.01) H01L 21/311 (2006.01)

Patent

CA 2306673

Pour le décapage de photoresist, l'invention propose d'utiliser un mélange de diméthylsulfoxyde (DMSO) ou de N-méthylpyrrolidone (NMP) et de 3-méthoxypropylamine (MOPA). Le mélange est avantageusement additionné d'un peu d'eau et d'un inhibiteur de corrosion comme le tolytriazolate de sodium.

Affiliated with

Also associated with

Rating

Mixture for the removal of light-sensitive resin in the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mixture for the removal of light-sensitive resin in the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mixture for the removal of light-sensitive resin in the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1988647