Modified epoxy resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/5428, 400/59

C08L 63/00 (2006.01) C08C 19/36 (2006.01) C08G 59/10 (2006.01) C08G 59/50 (2006.01) C08L 9/00 (2006.01)

Patent

CA 1187237

- 1 - Abstract The invention provides modified epoxy resin compositions having flexibility and compatibility with conventional epoxy resins as well as maintaining the desirable original proper- ties of the epoxy resin before modification, such as good mechanical strength, adhesion, heat resistance and chemical resistance. The compositions are obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100, the modified adduct being obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] containing one primary amino group in the molecule and a compound [C] containing a hydroxy group in the molecule. The modified epoxy resin compositions of the invention have the same uses as conventional epoxy resins, e.g. the compositions can be used as coatings, electrical insulators, materials for civil engineering and construction, adhesives, composite materials and the like.

392933

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