Modified epoxy resin composition

Details Modified epoxy resin composition Modified epoxy resin composition

C - Chemistry, Metallurgy

08

L

400/5428, 400/59

C08L 63/00 (2006.01) C08C 19/36 (2006.01) C08G 59/10 (2006.01) C08G 59/50 (2006.01) C08L 9/00 (2006.01)

Patent

CA 1187238

- 1 - Abstract: The invention provides a modified epoxy resin composi- tion having good flexibility and compatibility with conventional epoxy resins as well as maintaining the original properties of the epoxy resin before modification such as good mechanical strength, adhesion, heat resistance and chemical resistance. The modified epoxy resin is obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100. The modified adduct is obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] of the formula: Image [I] and a compound [C] of the formula: Image [II]. The modified epoxy resin composition of the invention has the same uses as conventional epoxy resins, e.g. the compo- sition can be used as a coating, an electrical insulator, a material for civil engineering and construction, an adhe- sive, a composite material and the like.

392934

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