Modified epoxy resin composition, process for preparation...

Details Modified epoxy resin composition, process for preparation... Modified epoxy resin composition, process for preparation...

C - Chemistry, Metallurgy

08

G

402/277, 400/590

C08G 59/14 (2006.01) C08G 59/62 (2006.01) C08G 59/64 (2006.01) C09D 163/00 (2006.01)

Patent

CA 1336524

Disclosed is a modified epoxy resin composition comprising a resin having recurring units represented by the following general formula: Image wherein R1 stands for -CH2-, Image , Image , Image , Image or Image , R2 stands for H or -CH3, R3 stands for H or a halogen atom, and having an epoxy group, a phenolic hydroxyl group and a primary alcoholic hydroxyl group as terminal functional groups in specific amounts. This composition has a high reactivity with an active methylol group, and when this composition is combined with a curing agent resin such as an amino resin or a phenolic resin, a coating having an excellent bending processability is obtained.

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