C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/42
C08G 8/28 (2006.01) C09D 5/44 (2006.01) G03F 7/023 (2006.01) G03F 7/16 (2006.01)
Patent
CA 1258344
- 1 - MODIFIED PHENOLIC RESINS AND THEIR PREPARATION ABSTRACT An electrodepositable photosensitive resin which is a phenolic novolak resin having (i) at least part of the phenolic hydroxyl groups thereof replaced by a quinone diazide sulphonyloxy group, and (ii) at least part of the aromatic rings thereof substituted in a position ortho and/or para to a phenolic hydroxyl group or quinone diazide sulphonyloxy group by a group of formula -CH(R1)R2 where R1 represents a hydrogen atom, or an alkyl, aryl or carboxylic acid gorup, and R2 represents a sulphonic acid group -SO3H or a group of formula -A-R3-X, R3 represents an aliphatic, aromatic or araliphatic divalent group which may be substituted by a carboxylic, sulphonic or phosphonic acid group, A represents a sulphur atom or a group of formula -N(R4)-, where R4 represents a hydrogen atom or an alkyl group which may be substituted by a carboyxlic acid group or by an optionally etherified hydroxyl group, or R3 and R4 together represent an alkylene chain of 2 to 5 carbon atoms linked to the indicated nitrogen atom, which may contain an oxygen atom or - 2 - an additional nitrogen atom in the chain, and X denotes a carboxylic or sulphonic acid group or, where A denotes -N(R4)-, X may further represent a phosphonic acid group, an amino group of formula -N(R5)(R6), a hydrogen atom or a hydroxyl group, and R5 and R6 which may be the same or different, each represent a hydrogen atom or an alkyl, aryl, aralkyl or alkenyl group, any of which may be substituted by a hydroxyl group. The resins are useful in the manufacture of printed circuits.
496525
Demmer Christopher G.
Irving Edward
Fetherstonhaugh & Co.
Vantico Ag
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