C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1822, 400/40
C08L 51/06 (2006.01) C09J 151/06 (2006.01)
Patent
CA 1131842
Abstract of the Disclosure The hot-melt adhesive of the present invention com- prise a blend of at least one modified polyethylene resin, an ethylene/lower alkyl acrylate copolymer and a tackifying resin. This hot-melt adhesive has a novel combination of properties including excellent elevated and low temperature properties in combination with good low temperature flexibility, and provides excellent adhesive to nonporous substrates such as latex backed carpet.
329499
Eastman Kodak Company
Gowling Lafleur Henderson Llp
LandOfFree
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