Modified polyethylene containing hot-melt adhesives useful...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/1822, 400/40

C08L 51/06 (2006.01) C09J 151/06 (2006.01)

Patent

CA 1131842

Abstract of the Disclosure The hot-melt adhesive of the present invention com- prise a blend of at least one modified polyethylene resin, an ethylene/lower alkyl acrylate copolymer and a tackifying resin. This hot-melt adhesive has a novel combination of properties including excellent elevated and low temperature properties in combination with good low temperature flexibility, and provides excellent adhesive to nonporous substrates such as latex backed carpet.

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